|
Project |
|
Normal ability |
Advanced capabilities |
|
Inner core board thickness |
Min |
0.1mm |
0.1mm |
|
Max |
2.0mm |
3.0mm |
|
|
line width and spacing |
Inner(1/3 or HOZ) |
3/3 mil /- 20% |
2/2 mil /- 20% |
|
Outer(1/3 or HOZ) |
3/3 mil /- 20% |
2/2 mil /- 20% |
|
|
impedance control |
--- |
/- 10% |
/- 5%(except 50 Ohms) |
|
copper thickness |
Max |
3/3 Oz |
4/4 Oz |
|
Complete plate thickness |
Min |
0.4mm |
0.35mm |
|
Max |
3.2mm |
3.5mm |
|
|
Complete the plate thickness tolerance |
>2.0mm and <3.5mm |
/- 10% |
/- 8% |
|
>1.0mm and <=2.0mm |
/- 10% |
/- 8% |
|
|
<=1.0mm |
/- 0.10mm |
/- 0.05mm |
|
|
number of layers |
Max |
10 layers |
14 layers |
|
Hole to copper gap |
4 layers |
7 mil |
6 mil |
|
6 layers |
8 mil |
6.5 mil |
|
|
8 layers |
8 mil |
7 mil |
|
|
Minimum mechanical hole completion aperture |
Min drill bit |
8 mil |
6 mil |
|
Aspect ratio |
Max |
12:1 |
14:1 |
|
V-cut remaining thickness |
--- |
/- 4 mil |
/- 3 mil |
|
Green oil |
Line to pad |
3 mil |
2 mil |
|
Solder mask bridge |
3 mil |
3 mil |
|
|
S/M bridge (black ink) |
5 mil |
4 mil |
|
|
Registration |
2 mil |
1.5 mil |
|
|
Plug in hole |
Size |
/- 3 mil |
/- 2 mil |
|
Pressure fit hole |
Size |
/- 2 mil |
/- 2 mil |
|
Hole tolerance |
Positional |
/- 3 mil |
/- 2 mil |
|
Non electroplated hole completion tolerance |
Size |
/- 2 mil |
2/-0 or 0/-2 mil |
|
Appearance tolerance |
--- |
/- 5 mil |
/- 2 mil |
|
HDI |
|
|
|
|
Plate thickness with laser drilling |
Min |
0.6 mm |
0.35 mm |
|
Max |
2.0 mm |
2.4 mm |
|
|
Blind hole type |
--- |
1 N 1,2 N 2,3 N 3,BVH |
Anylayer HDI |
|
Minimum aperture of resin plug hole |
Min |
0.15 mm |
0.08 mm |
|
Max |
0.8 mm |
1.5 mm |
|
|
Minimum pore size for copper backfilling |
Min |
0.08 mm |
0.08 mm |
|
Max |
0.5 mm |
0.5 mm |
|
|
Laser drill size |
--- |
0.07 mm |
0.15 mm |
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